Investigation of cosputtered W–C thin films as diffusion barriers
- Creators
- Yang, H. Y.
- Zhao, X.-A.
Abstract
Polycrystalline thin films of W–C were deposited on single-crystal <111>Si or SiO2 substrates by rf planar magnetron cosputtering of graphite (C) and W targets. The performance of cosputtered W75C25 thin films as diffusion barriers between a <111>Si substrate and metallic overlayers of Ag, Au, or Al was investigated. Backscattering spectrometry and x-ray diffraction are used to detect metallurgical interactions. Four-point probe measurement of resistance is employed to monitor the electrical stability of the metallization schemes upon thermal annealing in a vacuum for 30 min in temperature ranges from 500 to 700 °C. The electrical resistivity of W75C25 films is 140 µOmega cm. A W75C25 layer 1100 Å thick prevents metallurgical interdiffusion and reaction between Au or Ag overlayers and the <111>Si substrates up to 700 °C, and between an Al overlayer and the <111>Si substrate up to 450 °C.
Additional Information
© 1988 American Vacuum Society (Received 17 September 1987; accepted 23 November 1987)Files
Name | Size | Download all |
---|---|---|
md5:ef335507f117629689feca57e2f28511
|
565.7 kB | Preview Download |
Additional details
- Eprint ID
- 6459
- Resolver ID
- CaltechAUTHORS:YANjvsta88
- Created
-
2006-12-10Created from EPrint's datestamp field
- Updated
-
2021-11-08Created from EPrint's last_modified field