IC-integrated flexible shear-stress sensor skin

Creators: Xu, Yong; Tai, Yu-Chong; Huang, Adam; Ho, Chih-Ming

Abstract

This paper reports the successful development of the first IC-integrated flexible MEMS shear-stress sensor skin. The sensor skin is 1 cm wide, 2 cm long, and 70 /spl mu/m thick. It contains 16 shear-stress sensors, which are arranged in a 1-D array, with on-skin sensor bias, signal-conditioning, and multiplexing circuitry. We further demonstrated the application of the sensor skin by packaging it on a semicylindrical aluminum block and testing it in a subsonic wind tunnel. In our experiment, the sensor skin has successfully identified both the leading-edge flow separation and stagnation points with the on-skin circuitry. The integration of IC with MEMS sensor skin has significantly simplified implementation procedures and improved system reliability.

Additional Information

"© 2003 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE." Manuscript received July 17, 2002; revised April 7, 2003. Posted online: 2003-10-27. This work was supported by DARPA under the Navy Contract N66001-97-C-8610 and by the NSF Center for Neuromorphic System Engineering at Caltech. This paper is based upon a 2002 Hilton Head presentation. Subject Editor K. D. Wise. The authors would like to acknowledge the help from J. Boland, S. Walker Boland, M. Lige, J. Xie, Z. Han, and T. Roper.

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