Welcome to the new version of CaltechAUTHORS. Login is currently restricted to library staff. If you notice any issues, please email coda@library.caltech.edu
Published May 5, 1997 | Published
Journal Article Open

Prediction of multiple-feature effects in plasma etching

Abstract

Charging and topography evolution simulations during plasma etching of dense line-and-space patterns reveal that multiple-feature effects influence critically the etch profile characteristics of the various lines. By including neighboring lines, the simulation predicts a peculiar notching behavior, where the extent of notching varies with the location of the line. Feature-scale modeling can no longer be focused on individual features alone; "adjacency" effects are crucial for understanding and predicting the outcome of etching experiments at reduced device dimensions.

Additional Information

© 1997 American Institute of Physics. (Received 13 January 1997; accepted 3 March 1997) This material was based upon work supported by an NSF Career Award to KFG (CTS-9623450).

Attached Files

Published - HWAapl97e.pdf

Files

HWAapl97e.pdf
Files (128.0 kB)
Name Size Download all
md5:1cc491cb2c848cf8e6bbb29ce1d23e77
128.0 kB Preview Download

Additional details

Created:
August 22, 2023
Modified:
October 16, 2023