Published January 1975
| public
Journal Article
Open
Studies on the Al2O3–Ti–Mo–Au metallization system
Chicago
An error occurred while generating the citation.
Abstract
The behavior of Ti–Mo–Au metallization on Al2O3 and C has been investigated by backscattering spectrometry. Results show that Mo–Au bimetal films typically mix during deposition. Diffusion of Ti in Mo film occurs at 600°C, but is inhibited by the presence of oxygen in the Ti film. Even 1000 Å of Mo is not a barrier against interdiffusion of Ti and Au during 20–min anneals at 600°C. The amount of mixing observed also depends on the nature of the substrate which supports the Ti–Mo–Au metallization.
Additional Information
© 1975 American Vacuum Society. (Received 19 August 1974; final form 27 September 1974) We would like to thank to express our grateful appreciation to Motorola, Scottsdale, Arizona, for their participation in this project.Files
HARjvst75a.pdf
Files
(433.6 kB)
| Name | Size | Download all |
|---|---|---|
|
md5:5750603ef55b6434357e6da9643f93b2
|
433.6 kB | Preview Download |
Additional details
- Eprint ID
- 11023
- Resolver ID
- CaltechAUTHORS:HARjvst75a
- Created
-
2008-06-23Created from EPrint's datestamp field
- Updated
-
2021-11-08Created from EPrint's last_modified field