Published September 1, 2008
| Published
Journal Article
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Silver diffusion bonding and layer transfer of lithium niobate to silicon
Abstract
A diffusion bonding method has been developed that enables layer transfer of single crystal lithium niobate thin films to silicon substrates. A silver film was deposited onto both the silicon and lithium niobate surfaces prior to bonding, and upon heating, a diffusion bond was formed. Transmission electron microscopy confirms the interface evolution via diffusion bonding which combines interfacial diffusion, power law creep, and growth of (111) silver grains to replace the as-bonded interface by a single polycrystalline silver film. The transferred film composition was the same as bulk lithium niobate.
Additional Information
© 2008 American Institute of Physics. Received 7 July 2008; accepted 8 August 2008; published 5 September 2008. This work was supported by the Army Research Office (ARO-MURI) under Grant No. DAAD 19-01-1-0517 and the Caltech KNI and Materials Science TEM facilities supported by the MRSEC Program of the National Science Foundation under Award No. DMR-0520565.Attached Files
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Additional details
- Eprint ID
- 11585
- Resolver ID
- CaltechAUTHORS:DIEapl08
- DAAD 19-01-1-0517
- Army Research Office (ARO)
- DMR-0520565
- NSF
- Created
-
2008-09-08Created from EPrint's datestamp field
- Updated
-
2021-11-08Created from EPrint's last_modified field
- Caltech groups
- Kavli Nanoscience Institute