Published September 24, 2007
| Published
Journal Article
Open
Surface encapsulation for low-loss silicon photonics
Chicago
Abstract
Encapsulation layers are explored for passivating the surfaces of silicon to reduce optical absorption in the 1500 nm wavelength band. Surface-sensitive test structures consisting of microdisk resonators are fabricated for this purpose. Based on previous work in silicon photovoltaics, coatings of SiNx and SiO2 are applied under varying deposition and annealing conditions. A short dry thermal oxidation followed by a long high-temperature N2 anneal is found to be most effective at long-term encapsulation and reduction of interface absorption. Minimization of the optical loss is attributed to simultaneous reduction in sub-band-gap silicon surface states and hydrogen in the capping material.
Additional Information
© 2007 American Institute of Physics. (Received 2 July 2007; accepted 13 September 2007; published online 28 September 2007) This work was supported through the DARPA EPIC program. For graduate fellowship support, we thank the Moore Foundation (M.B. and C.P.M.), NPSC (M.B.), HRL Laboratories (M.B.), NSF (C.P.M.), and the Hertz Foundation (M.D.H.)Attached Files
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Additional details
- Eprint ID
- 8923
- Resolver ID
- CaltechAUTHORS:BORapl07
- Defense Advanced Research Projects Agency (DARPA)
- Gordon and Betty Moore Foundation
- National Physical Science Consortium
- Hughes Research Laboratories
- NSF
- Fannie and John Hertz Foundation
- Created
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2007-10-01Created from EPrint's datestamp field
- Updated
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2021-11-08Created from EPrint's last_modified field