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Published October 6, 2022 | public
Journal Article

Extending the spectrum of fully integrated photonics to submicrometre wavelengths

Abstract

Integrated photonics has profoundly affected a wide range of technologies underpinning modern society. The ability to fabricate a complete optical system on a chip offers unrivalled scalability, weight, cost and power efficiency. Over the last decade, the progression from pure III–V materials platforms to silicon photonics has significantly broadened the scope of integrated photonics, by combining integrated lasers with the high-volume, advanced fabrication capabilities of the commercial electronics industry. Yet, despite remarkable manufacturing advantages, reliance on silicon-based waveguides currently limits the spectral window available to photonic integrated circuits (PICs). Here, we present a new generation of integrated photonics by directly uniting III–V materials with silicon nitride waveguides on Si wafers. Using this technology, we present a fully integrated PIC at photon energies greater than the bandgap of silicon, demonstrating essential photonic building blocks, including lasers, amplifiers, photodetectors, modulators and passives, all operating at submicrometre wavelengths. Using this platform, we achieve unprecedented coherence and tunability in an integrated laser at short wavelength. Furthermore, by making use of this higher photon energy, we demonstrate superb high-temperature performance and kHz-level fundamental linewidths at elevated temperatures. Given the many potential applications at short wavelengths, the success of this integration strategy unlocks a broad range of new integrated photonics applications.

Additional Information

We thank B. Dong and D. Kinghorn for assistance with measurements, S. Palmer for fruitful discussion, Z. Zhou for format modifications and L. McKinney, B. Long and Y. Chen for graphic sketches. We also thank L. Coldren for discussion of high temperature laser performance, as well as D. Weld and J. Wang for discussion of atomic physics applications. A portion of this work was performed in the UCSB Nanofabrication Facility, an open access laboratory. Part of this work and material (related to UCSB and Caltech) is based on work supported by the Defense Advanced Research Projects Agency (DARPA) under contract no. HR001-20-2-0044. Any opinions, findings and conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the Defense Advanced Research Projects Agency (DARPA). Data availability. The data presented in this paper's figures are available on https://zenodo.org/record/6757842#.YrknDtLMKV4. Code availability. The codes that support the findings of this study are available from the corresponding authors upon reasonable request.

Additional details

Created:
August 22, 2023
Modified:
October 24, 2023