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Published April 2021 | public
Journal Article

Selenium‐doping induced two antiferromagnetic transitions in thiospinel compounds CuCo₂S_(4‐x)Se_x (0 ≤ x ≤ 0.8)

Abstract

A series of copper thiospinels compounds, CuCo₂S_(4‐x)Se_x (x = 0, 0.2, 0.4, 0.6, 0.8), have been successfully synthesized by solid state reaction and their structure and magnetic properties have been studied. The Rietveld refinements of X‐Ray diffractions indicate that both the lattice constants and the nearest neighbor Cu‐Cu distances increase with increasing selenium doping. A weakly antiferromagnetic transition occurring at about 4 K is observed in CuCo₂S₄. Two antiferromagnetic transitions at about 3.5 K and 6 K are observed in selenium‐doped samples, which suggest that the exchange couplings associated with Cu‐S(Se)‐Cu and Cu‐Se(S)‐Cu, respectively, are responsible for the two antiferromagnetic transitions. Detailed analysis of the experimental results further indicate that the nearest‐neighbor molecular field coefficient is comparable to the next‐neighbor molecular field coefficient. We propose a reasonable model to explain this phenomenon.

Additional Information

© 2020 The American Ceramic Society. Issue Online: 31 January 2021; Version of Record online: 20 December 2020; Accepted manuscript online: 02 December 2020; Manuscript accepted: 15 November 2020; Manuscript revised: 18 October 2020; Manuscript received: 15 July 2020. This work at the Shanghai University (SHU) is jointly supported by the Ministry of Science and Technology of the People's Republic of China 2016YFB0700201, National Natural Science Foundation of China (11774217, 10904088), Shanghai Pujiang Program (13PJD015), and Science and Technology commission of Shanghai Municipality (13ZR1415200). N.‐C. Yeh acknowledges the research support from the National Science Foundation (Award #1733907) and the Army Research Office (Award #W911NF‐16‐1‐0472) in United States, and the hospitality and sponsorship of her visit to the SHU under the Overseas Expert Recruitment Program at SHU.

Additional details

Created:
August 22, 2023
Modified:
October 23, 2023