P-60: Single-Step Plasma-Enhanced Chemical Vapor Deposition of Graphene on Cu Ink and Sputtered Cu Thin Films

Abstract

Ink materials for Inkjet Printing generally suffer from low conductivity, whereas the thickness of Cu interconnects requires further reduction for better flexibility. Here we demonstrate successful growth of graphene on both Cu Ink and sputtered Cu by plasma‐enhanced chemical vapor deposition as a promising solution to address the aforementioned issues.

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