Published August 2019
| Submitted + Published
Journal Article
Open
Crossover between Electron-Phonon and Boundary-Resistance Limits to Thermal Relaxation in Copper Films
Chicago
Abstract
We observe a crossover from electron-phonon (e-ph) coupling limited energy relaxation to that governed by thermal boundary resistance (phonon-phonon coupling, ph-ph) in copper films at subkelvin temperatures. Our measurement yields a quantitative picture of heat currents, in terms of temperature dependences and magnitudes, in both e-ph and pp limited regimes, respectively. We show that by adding a third layer in between the copper film and the substrate, the thermal boundary resistance is increased fourfold, consistent with an assumed series connection of thermal resistances.
Additional Information
© 2019 American Physical Society. Received 26 March 2019; revised manuscript received 29 July 2019; published 23 August 2019. We acknowledge the provision of the fabrication facilities by Otaniemi research infrastructure for micro and nanotechnologies (OtaNano). This work was performed as part of the Academy of Finland Centre of Excellence program (Project No. 312057) and the European Research Council (ERC) under the European Union's Horizon 2020 research and innovation program (Grant No. 2742559 SQH).Attached Files
Published - PhysRevApplied.12.024051.pdf
Submitted - 1903.10848.pdf
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PhysRevApplied.12.024051.pdf
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Additional details
- Alternative title
- Crossover between electron-phonon and boundary resistance limited thermal relaxation in copper films
- Eprint ID
- 98590
- Resolver ID
- CaltechAUTHORS:20190911-154315210
- Academy of Finland
- 312057
- European Research Council (ERC)
- 2742559
- Created
-
2019-09-11Created from EPrint's datestamp field
- Updated
-
2021-11-16Created from EPrint's last_modified field
- Caltech groups
- Kavli Nanoscience Institute