Published June 2005
| Published
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Parylene-strengthened thermal isolation technology for microfluidic system-on-chip applications
- Creators
- Shih, Chi-Yuan
-
Chen, Yang
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Tai, Yu-Chong
Chicago
Abstract
Here we reported a novel technology using parylene-cross-linking structure to achieve on-chip air-gap thermal isolation for microfluidic system-on-chip (SOC) applications. Two applications based on this technology, on-chip continuous-flow polymerase chain reaction (PCR) and on-chip temperature gradient liquid chromatography (LC) were successfully demonstrated. Device thermal performance in each example was characterized. Results showed that our technology not only provides excellent on-chip thermal isolation but also its simplicity of integration with other on-chip components makes versatile microfluidic SOC applications feasible.
Additional Information
© 2005 IEEE. This work was supported by the NSF Center for Neuromorphic Systems Engineering (CNSE) at Caltech. The authors would also like to thank Mr. Trevor Roper for his assistance in processing.Attached Files
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Additional details
- Eprint ID
- 94078
- Resolver ID
- CaltechAUTHORS:20190322-155554314
- Center for Neuromorphic Systems Engineering, Caltech
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2019-03-22Created from EPrint's datestamp field
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2021-11-16Created from EPrint's last_modified field