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Published February 20, 2019 | Supplemental Material
Journal Article Open

Csp^3-Csp^3 Bond-Forming Reductive Elimination from Well-Defined Copper(III) Complexes

Abstract

Carbon–carbon bond-forming reductive elimination from elusive organocopper(III) complexes has been considered the key step in many copper-catalyzed and organocuprate reactions. However, organocopper(III) complexes with well-defined structures that can undergo reductive elimination are extremely rare, especially for the formation of Csp^3–Csp^3 bonds. We report herein a general method for the synthesis of a series of [alkyl-Cu^(III)-(CF_3)_3]^− complexes, the structures of which have been unequivocally characterized by NMR spectroscopy, mass spectrometry, and X-ray crystal diffraction. At elevated temperature, these complexes undergo reductive elimination following first-order kinetics, forming alkyl-CF3 products with good yields (up to 91%). Both kinetic studies and DFT calculations indicate that the reductive elimination to form Csp^3–CF^3 bonds proceeds through a concerted transition state, with a ΔH⧧ = 20 kcal/mol barrier.

Additional Information

© 2019 American Chemical Society. Received: November 25, 2018; Published: January 25, 2019. W.L. thanks Miami University for the start-up funding. L.-Y.C., J.-C.H., and M.-J.C. acknowledge financial support from the Ministry of Science and Technology of the Republic of China under grant no. MOST 107-2113-M-006-008-MY2. We also thank Dr. Theresa Ramelot for assistance with HR-ESI and Prof. John Rakovan for assistance with X-ray crystal diffraction. W.A.G. acknowledges financial support from NSF (NSF CBET 1512759). The authors declare no competing financial interest.

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Supplemental Material - ja8b12632_si_001.pdf

Supplemental Material - ja8b12632_si_002.cif

Supplemental Material - ja8b12632_si_003.cif

Supplemental Material - ja8b12632_si_004.cif

Supplemental Material - ja8b12632_si_005.cif

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Additional details

Created:
August 22, 2023
Modified:
October 20, 2023