Microcoining ripples in metal foils

Abstract

Experiments, upper bound models, and finite element simulations are used to determine forming loads needed to microcoin surface ripples in thin metal foils. Coining is traditionally performed in a closed die, however enclosing all non-patterned surfaces is difficult to directly scale down to sub-millimeter foils. We find different forming regimes can exist at this small scale in an open pressing configuration. We explore the effects of the metal foil thickness and its work hardening behavior, two primary factors controlling the microcoining ripple forming load. For very thin foils, the load needed to coin a ripple pattern is lower than the load needed to compress the foil so that the open pressing configuration behavior is effectively closed with pattern formation without thickness change. For moderate thickness foils, the load needed to coin significantly drops as the entire foil compresses. For thick foils approaching bulk materials, the pattern will not completely form as the die macroscopically indents into the metal. Work hardening is found to raise the forming load for the thin, effectively closed die scenario, however it is a secondary effect at moderate thickness. This insight is used to microcoin patterns in extremely hard, thin metal foils.

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