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Published April 2016 | Supplemental Material
Journal Article Open

Application of 3D Printing for Smart Objects with Embedded Electronic Sensors and Systems

Ota, Hiroki
Emaminejad, Sam
Gao, Yuji
Zhao, Allan
Wu, Eric
Challa, Samyuktha
Chen, Kevin ORCID icon
Fahad, Hossain M.
Jha, Amit K.
Kiriya, Daisuke ORCID icon
Gao, Wei ORCID icon
Shiraki, Hiroshi
Morioka, Kazuhito
Ferguson, Adam R.
Healy, Kevin E.
Davis, Ronald W.
Javey, Ali ORCID icon
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Abstract

Applications of a 3D printing process are presented. This process integrates liquid-state printed components and interconnects with IC chips in all three dimensions, various orientations, and multiple printing layers to deliver personalized system-level functionalities. As an example application, a form-fitting glove is demonstrated with embedded programmable heater, temperature sensor, and the associated control electronics for thermotherapeutic treatment.

Additional Information

© 2016 Wiley. Received: February 1, 2016. Published online: March 2, 2016. H.O. and S.E. contributed equally to this work. This work was supported by the NSF NASCENT Center, National Institutes of Health Grant P01 HG000205, and the Director, Office of Science, Office of Basic Energy Sciences, Material Sciences and Engineering Division of the U.S. Department of Energy under Contract No. DE-AC02-05CH11231. H.O. acknowledges support from the Japan Society for the Promotion of Science (JSPS) Fellowship. Y.G. acknowledges support from the China Scholarship Council (File No. 201406250097). The authors thank J. Lotz, K. Gary, Y. Leng, the staff in CITRIS INVENTION LAB of University of California, Berkeley, and Electronic Materials Program (E-Mat) of Lawrence Berkeley National Laboratory for their help.

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