Welcome to the new version of CaltechAUTHORS. Login is currently restricted to library staff. If you notice any issues, please email coda@library.caltech.edu
Published July 2017 | Submitted + Supplemental Material + Published
Journal Article Open

Al transmon qubits on silicon-on-insulator for quantum device integration

Abstract

We present the fabrication and characterization of an aluminum transmon qubit on a silicon-on-insulator substrate. Key to the qubit fabrication is the use of an anhydrous hydrofluoric vapor process which selectively removes the lossy silicon oxide buried underneath the silicon device layer. For a 5.6 GHz qubit measured dispersively by a 7.1 GHz resonator, we find T_1 = 3.5 μs and T_2* = 2.2 μs. This process in principle permits the co-fabrication of silicon photonic and mechanical elements, providing a route towards chip-scale integration of electro-opto-mechanical transducers for quantum networking of superconducting microwave quantum circuits. The additional processing steps are compatible with established fabrication techniques for aluminum transmon qubits on silicon.

Additional Information

© 2017 Published by AIP Publishing. Received 3 April 2017; accepted 5 July 2017; published online 25 July 2017. We gratefully acknowledge the Martinis Group (UCSB/Google) for their amplifier and filter designs, Dan Vestyck for his support of our uEtch HF vapor tool, and Mark Rosamond for discussions. This work was supported by the AFOSR MURI Quantum Photonic Matter (Grant No. 16RT0696), the AFOSR MURI Wiring Quantum Networks with Mechanical Transducers (Grant No. FA9550-15-1-0015), the Institute for Quantum Information and Matter, an NSF Physics Frontiers Center (Grant No. PHY-1125565) with the support of the Gordon and Betty Moore Foundation, and the Kavli Nanoscience Institute at Caltech. A.J.K. acknowledges the IQIM Postdoctoral Fellowship.

Attached Files

Published - 1_2E4994661.pdf

Submitted - 1703.10195.pdf

Supplemental Material - supplementary_material_v2.pdf

Files

1_2E4994661.pdf
Files (5.5 MB)
Name Size Download all
md5:9a128ee99c56a702d4f4b7a8e035d14b
1.2 MB Preview Download
md5:79cfaf3ee847a2ae7e672795972bbad3
3.0 MB Preview Download
md5:faeb436f93e556eed08ee3fa3f8d62e0
1.3 MB Preview Download

Additional details

Created:
August 19, 2023
Modified:
October 25, 2023