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Published March 3, 2004 | Supplemental Material
Journal Article Open

Solvent-Resistant Photocurable "Liquid Teflon" for Microfluidic Device Fabrication

Abstract

We report the first fabrication of a solvent-compatible microfluidic device based on photocurable "Liquid Teflon" materials. The materials are highly fluorinated functionalized perfluoropolyethers (PFPEs) that have liquidlike viscosities that can be cured into tough, highly durable elastomers that exhibit the remarkable chemical resistance of fluoropolymers such as Teflon. Poly(dimethylsiloxane) (PDMS) elastomers have rapidly become the material of choice for many recent microfluidic device applications. Despite the advantages of PDMS in relation to microfluidics technology, the material suffers from a serious drawback in that it swells in most organic solvents. The swelling of PDMS-based devices in organic solvents greatly disrupts the micrometer-sized features and makes it impossible for fluids to flow inside the channels. Our approach to this problem has been to replace PDMS with photocurable perfluoropolyethers. Device fabrication and valve actuation were accomplished using established procedures for PDMS devices. The additional advantage of photocuring allows fabrication time to be decreased from several hours to a matter of minutes. The PFPE-based device exhibited mechanical properties similar to those of Sylgard 184 before and after curing as well as remarkable resistance to organic solvents. This work has the potential to expand the field of microfluidics to many novel applications.

Additional Information

© 2004 American Chemical Society. Received 11 December 2003. Published online 6 February 2004. Published in print 1 March 2004. We acknowledge funding from the William R. Kenan Professorship of the University of North Carolina at Chapel Hill, the Norton Simon Foundation, as well as from the Office of Naval Research No. N000140210185. Dr. Saad Khan and Angelica Sanchez of NC State are acknowledged for help with rheology along with Dr. Otto Zhou and Huaizhi Geng of UNC for help with DMA.

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August 19, 2023
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