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Published May 15, 2017 | Submitted + Published
Journal Article Open

Experimental metrology to obtain thermal phonon transmission coefficients at solid interfaces

Abstract

Interfaces play an essential role in phonon-mediated heat conduction in solids, impacting applications ranging from thermoelectric waste heat recovery to heat dissipation in electronics. From the microscopic perspective, interfacial phonon transport is described by transmission coefficients that link vibrational modes in the materials composing the interface. However, direct experimental determination of these coefficients is challenging because most experiments provide a mode-averaged interface conductance that obscures the microscopic detail. Here, we report a metrology to extract thermal phonon transmission coefficients at solid interfaces using ab initio phonon transport modeling and a thermal characterization technique, time-domain thermoreflectance. In combination with transmission electron microscopy characterization of the interface, our approach allows us to link the atomic structure of an interface to the spectral content of the heat crossing it. Our work provides a useful perspective on the microscopic processes governing interfacial heat conduction.

Additional Information

© 2017 American Physical Society. Received 23 December 2016; revised manuscript received 17 March 2017; published 17 May 2017. The authors thank L. Lindsay, and N. Mingo for providing the first-principles calculations for silicon, Nathan Lewis group for the access to the ellipsometer, and the Kavli Nanoscience Institute (KNI) at Caltech for the availability of critical cleanroom facilities. X. C. thanks Melissa A. Melendes, Matthew H. Sullivan, and Carol M. Garland from the KNI for fabrication assistance, and Victoria W. Dix from the Lewis group at Caltech for the help with the ellipsometer measurements. This work was sponsored in part by the National Science Foundation under Grant No. CBET 1254213, and by Boeing under the Boeing-Caltech Strategic Research & Development Relationship Agreement. C.H. and X.C. contributed equally to this work.

Attached Files

Published - PhysRevB.95.205423.pdf

Submitted - 1509.07806v1.pdf

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Additional details

Created:
August 19, 2023
Modified:
October 17, 2023