Cross-plane heat conduction in thin solid films
- Creators
- Hua, Chengyun
-
Minnich, Austin J.
Abstract
Cross-plane heat transport in thin films with thickness comparable to the phonon mean free paths is of both fundamental and practical interest. However, physical insight is difficult to obtain for the cross-plane geometry due to the challenge of solving the Boltzmann equation in a finite domain. Here, we present a semi-analytical series expansion method to solve the transient, frequency-dependent Boltzmann transport equation that is valid from the diffusive to ballistic transport regimes and rigorously includes frequency-dependence of phonon properties. Further, our method is more than three orders of magnitude faster than prior numerical methods and provides a simple analytical expression for the thermal conductivity as a function of film thickness. Our result enables a more accurate understanding of heat conduction in thin films.
Additional Information
This work was sponsored in part by Robert Bosch LLC through Bosch Energy Research Network Grant no. 13.01.CC11, by the National Science Foundation under Grant no. CBET CAREER 1254213, and by Boeing under the Boeing-Caltech Strategic Research & Development Relationship Agreement.Attached Files
Submitted - 1410.2845.pdf
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Additional details
- Eprint ID
- 50835
- Resolver ID
- CaltechAUTHORS:20141027-095518248
- Robert Bosch LLC Bosch Energy Research Network
- 13.01.CC11
- NSF CBET CAREER
- 1254213
- Boeing-Caltech Strategic Research & Development Relationship Agreement
- Created
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2014-10-27Created from EPrint's datestamp field
- Updated
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2023-06-02Created from EPrint's last_modified field