Published 1990
| public
Book Section - Chapter
Microcrack Toughening in a SiC-TiB_2 Composite
- Creators
- Cai, H.
- Gu, W.-H.
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Faber, K. T.
Chicago
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Abstract
Transmission electron microscopy observations of a fractured SiC-TiB_2 composite have provided conclusive evidence of stress-induced microcracking in this system. The microcrack density parameter around a steadily growing crack has been measured as a function of the distance from the crack plane. Microcrack toughening in this system has been assessed using a discrete model based on the measured microcrack density parameter. The computation results indicate that nearly half of the toughening arises from stress-induced microcracking. Other possible toughening mechanisms are also discussed.
Additional Information
© 1990 Technomic Publishing. This work was supported by the National Science Foundation under Grant No. DMR-8896212. Materials used in this study were graciously provided by The Carborundum Co., Niagara Falls, NY.Additional details
- Alternative title
- Microcrack Toughening in a SiC-TiB2 Composite
- Eprint ID
- 49800
- Resolver ID
- CaltechAUTHORS:20140917-175220552
- NSF
- DMR-8896212
- Carborundum Company
- Created
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2014-09-18Created from EPrint's datestamp field
- Updated
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2020-03-03Created from EPrint's last_modified field