Published June 5, 1995
| Published
Journal Article
Open
Fracture strength of free‐standing chemically vapor‐deposited diamond films
- Creators
- Steyer, Todd E.
-
Faber, K. T.
- Drory, Michael D.
Chicago
An error occurred while generating the citation.
Abstract
The fracture strength of free‐standing chemically vapor‐deposited diamond films was assessed by four‐point bending. A two‐parameter Weibull analysis was performed on 130 μm thick films resulting in a Weibull modulus of 4.3 and a statistical scaling stress of 626 MPa. The residual stress in films was measured from the free‐standing film curvature to be 384±10 MPa. The fracture surface chemistry was examined using scanning Auger spectroscopy. The fracture did not occur preferentially along grain boundaries.
Additional Information
© 1995 American Institute of Physics. (Received 11 October 1994; accepted for publication 18 March 1995). The authors wish to thank D. Spaulding and Y.-W. Chung for their assistance in scanning Auger spectroscopy analysis. Support of this work was provided by the National Science Foundation under Grant No. DMR-9023629 for T.E.S. and K.T.F. and Grant No. III-9360024 for M.D.D.Attached Files
Published - 1.113617.pdf
Files
1.113617.pdf
Files
(241.3 kB)
| Name | Size | Download all |
|---|---|---|
|
md5:f9ff1533c984bb4af44be9abc1d4abb8
|
241.3 kB | Preview Download |
Additional details
- Eprint ID
- 49425
- Resolver ID
- CaltechAUTHORS:20140908-181327215
- NSF
- DMR-9023629
- NSF
- III-9360024
- Created
-
2014-09-10Created from EPrint's datestamp field
- Updated
-
2021-11-10Created from EPrint's last_modified field