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Published September 2007 | public
Journal Article

Thermal Conductivity of Porous Silicon Carbide Derived from Wood Precursors

Abstract

Biomorphic silicon carbide (bioSiC), a novel porous ceramic derived from natural wood precursors, has potential applicability at high temperatures, particularly when rapid temperature changes occur. The thermal conductivity of bioSiC from five different precursors was experimentally determined using flash diffusivity and specific heat measurements at temperatures ranging from room temperature to 1100°C. The results were compared with values obtained from object-oriented finite-element analysis (OOF). OOF was also used to model and understand the heat-flow paths through the complex bioSiC microstructures.

Additional Information

© 2007 The American Ceramic Society. Manuscript No. 22840. Received February 23, 2007; Approved March 31, 2007; Article first published online: 2 AUG 2007. This work is financially supported by the National Science Foundation Grant DMR- 0244258. This material is based upon work supported under a National Science Foundation Graduate Research Fellowship. A portion of the research was sponsored by the Assistant Secretary for Energy Efficiency and Renewable Energy, Office of Transportation Technologies, as part of the High-Temperature Materials Laboratory User Program, Oak Ridge National Laboratory, managed by UT-Battelle LLC, for the U.S. Department of Energy under contract number DE-AC05- 00OR22725. NUANCE Center is supported by NSF-NSEC, NSF-MRSEC, Keck Foundation, the State of Illinois, and Northwestern University. The SEM work was performed in the EPIC facility of NUANCE Center at Northwestern University. The authors would also like to acknowledge Vikram Kaul (Northwestern University), Edwin R. Fuller, Jr., and Stephen A. Langer (National Institute of Standards and Technology) for their assistance with OOF.

Additional details

Created:
August 19, 2023
Modified:
October 26, 2023