Published March 2010
| public
Journal Article
Processing of wood-derived copper–silicon carbide composites via electrodeposition
Abstract
An electrodeposition technique has been adapted to produce copper–silicon carbide composites with honeycomb-like microstructures. The detrimental Cu–SiC reaction was avoided by using this room temperature processing technique. The wood-derived silicon carbide phase allows for tailorable microstructures due to the variety of available wood precursors. Plating efficiency for each wood type was determined using image analysis. This processing method results in the successful filling of pores with aspect ratios of up to 100.
Additional Information
© 2010 Elsevier Ltd. Received 11 August 2009; Received in revised form 18 November 2009; Accepted 22 December 2009; Available online 4 January 2010. This work was funded by the National Science Foundation (DMR-0710630). The SEM and TEM work was performed in the EPIC facilities of NUANCE Center at Northwestern University. NUANCE Center is supported by NSF-NSEC, NSF-MRSEC, Keck Foundation, the State of Illinois, and Northwestern University. This work made use of the J.B. Cohen X-ray Diffraction Facility supported by the MRSEC program of the National Science Foundation (DMR-0520513) at the Materials Research Center of Northwestern University. The authors also want to acknowledge F.M. Varela-Feria, J. Ramírez-Rico and J. Martínez-Fernández of the Departmento de Fisica de la Materia Condensada at the Universidad de Sevilla for initial TEM microscopy results.Additional details
- Eprint ID
- 47182
- Resolver ID
- CaltechAUTHORS:20140714-133958799
- DMR-0710630
- NSF
- W. M. Keck Foundation
- State of Illinois
- Northwestern University
- DMR-0520513
- NSF
- Created
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2014-07-14Created from EPrint's datestamp field
- Updated
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2021-11-10Created from EPrint's last_modified field