Thermal cure effects on electrical performance of nanoparticle silver inks

Abstract

Physical, electrical, and morphological properties of thermally annealed silver nanoparticle thin films are described. These solution-deposited nanoparticle thin films form highly conducting films at low curing temperatures via sintering due to the high surface area to volume ratio. Measured resistivity correlates with thickness decrease and densification, and can be explained by a simple geometrical model applicable to the sintering process. Consideration of the active sintering mechanisms provides the basis for a phenomenological model predicting optimal pathways to achieve desired electrical performance.

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