Viscoplasticity of parylene-C film at body temperature
Abstract
As parylene-C, a thermal plastic, has been extensively used as an implant material, its viscoplastic behavior at body temperature has never been systematically studied. Presented here is the first extensive in vitro study of the viscoplastic behaviors of 20-μm-thick parylene-C film at 37°C. The viscoplastic behaviors are investigated by uniaxial tensile tests at different strain rates (Figure 2), cyclic loading/unloading test (Figure 3) abrupt strain rate changing (Figure 4), creep-recovery (Figure 5), and stress-relaxation (Figure 6). There are three major conclusions here. First, below a stress of 2.5MPa, no observable viscoplastic behavior of 20-μm-thick parylene-C is found. Secondly, parylene-C film is a strain (or stress) and strain-rate dependent viscoplastic material. Thirdly, Burger's model is adequate to describe both creep and stress relaxation behaviors. In addition, the rate of the creep recovery (modeled with a single time constant) and stress relaxation (modeled with two time constants) decreases with increasing applied stress and/or strain.
Additional Information
© 2012 IEEE. Date of Current Version: 15 March 2012. This work is supported by the Biomimetic MicroElectronic Systems (BMES) Center under the grant number H31068. The authors would like to thank Trevor Roper's help in terms of sample preparation, machines' maintenance, and instrument's installation.Additional details
- Eprint ID
- 36730
- DOI
- 10.1109/MEMSYS.2012.6170170
- Resolver ID
- CaltechAUTHORS:20130201-093804872
- Biomimetic MicroElectronic Systems (BMES)
- H31068
- Created
-
2013-02-25Created from EPrint's datestamp field
- Updated
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2021-11-09Created from EPrint's last_modified field
- Other Numbering System Name
- INSPEC Accession Number
- Other Numbering System Identifier
- 12618017