Published October 2003
| public
Book Section - Chapter
Bringing Optics Inside the Box: Recent Progress and Future Trends
Chicago
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Abstract
Needs and requirements for optical interconnects in next generation servers are outlined. Related results on equalizing and characterizing high speed multimode links, building and testing parallel 12 × 10 Gbit/sec transceivers, and highly parallel silicon photodetectors are presented.
Additional Information
© 2003 IEEE. Issue Date: 27-28 Oct. 2003; Date of Current Version: 07 January 2004. This work was partially supported by NIST through the Photonics CAD ATP.Additional details
- Eprint ID
- 27332
- DOI
- 10.1109/LEOS.2003.1251644
- Resolver ID
- CaltechAUTHORS:20111020-133215948
- NIST Photonics CAD ATP
- Created
-
2011-10-20Created from EPrint's datestamp field
- Updated
-
2021-11-09Created from EPrint's last_modified field
- Series Name
- IEEE Lasers and Electro-Optics Society (LEOS) Annual Meeting
- Other Numbering System Name
- INSPEC Accession Number
- Other Numbering System Identifier
- 8095812