Tensile deformation of electroplated copper nanopillars
- Creators
- Jennings, Andrew T.
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Greer, Julia R.
Abstract
The results are presented of uniaxial tensile testing of single crystalline electroplated copper nanopillars with diameters between 75 nm and 165 nm fabricated without the use of a focused ion beam (FIB). The experiments were performed in an in situ nanomechanical instrument, SEMentor, and reveal that the pillars' ultimate tensile strengths follow a similar power law dependence on diameter as reported for microcompression studies on fcc metals fabricated with and without FIB. Further, these pillars are characterized by limited or non-existent initial homogeneous deformation, immediately followed by necking in the top portion of the pillar. The particular deformation attributes are discussed in the context of hardening by dislocation starvation. Site-specific transmission electron microscopy microstructural analysis of as-fabricated nanopillars indicates the presence of scarce twin boundaries in some specimens. We comment on the potential for mechanical effects due to the presence of twins.
Additional Information
© 2011 Taylor & Francis. Received 17 November 2009; final version received 26 June 2010. First Published on: 20 August 2010. The authors gratefully acknowledge the financial support of the NSF CAREER award (DMR-0748267). We also thank J.-Y. Kim for tip fabrication and discussions, M.J. Burek for electroplating materials and helpful discussions, and C.M. Garland for TEM discussions and assistance.Additional details
- Eprint ID
- 23189
- Resolver ID
- CaltechAUTHORS:20110331-103319686
- DMR-0748267
- NSF
- Created
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2011-03-31Created from EPrint's datestamp field
- Updated
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2021-11-09Created from EPrint's last_modified field