Published January 2008
| Published
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Implantable RF-coiled chip packaging
- Creators
- Li, W.
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Rodger, D. C.
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Tai, Y. C.
Chicago
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Abstract
In this paper, we present an embedded chip integration technology that utilizes silicon housings and flexible parylene radio frequency (RF) coils. As a demonstration of this technology, a flexible parylene RF coil has been integrated with an RF identification (RFID) chip. The coil has an inductance of 16 μH, with two layers of metal completely encapsulated in parylene-C. The functionality of the embedded chip is verified using an RFID reader module. Accelerated-lifetime soak testing has been performed in saline, and the results show that the silicon chip is well protected and the lifetime of our parylene-encapsulated RF coil at 37 °C is more than 20 years.
Additional Information
© 2008 IEEE. This work is supported in part by the Engineering Research Center Program of the National Science Foundation under Award Number EEC-0310723 and by a fellowship from the Whitaker Foundation (D.R.). The authors would also like to thank Mr. Trevor Roper and other members of the Caltech Micromachining Laboratory for assistance with fabrication.Attached Files
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Li2008p8709Mems_2008_21St_Ieee_International_Conference_On_Micro_Electro_Mechanical_Systems_Technical_Digest.pdf
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Additional details
- Eprint ID
- 19089
- Resolver ID
- CaltechAUTHORS:20100715-142417092
- NSF
- EEC-0310723
- Whitaker Foundation
- Created
-
2010-08-06Created from EPrint's datestamp field
- Updated
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2021-11-08Created from EPrint's last_modified field
- Series Name
- Proceedings: IEEE Micro Electro Mechanical Systems