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Published 2009 | Published
Book Section - Chapter Open

The Future of High Frequency Circuit Design

Hajimiri, Ali ORCID icon
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Abstract

The cut-off wavelengths of integrated silicon transistors have exceeded the die sizes of the chips being fabricated with them. Combined with the ability to integrate billions of transistors on the same die, this size-wavelength cross-over has produced a unique opportunity for a completely new class of holistic circuit design combining electromagnetics, device physics, circuits, and communication system theory in one place. In this paper, we discuss some of these opportunities and their associated challenges in greater detail and provide a few of examples of how they can be used in practice.

Additional Information

© 2009 IEEE. This work has been supported in part by Lee Center for Advanced Networking. The author would like to particularly thank Dr. A. Babakhani, as well as F. Bohn, A. Chang, K. Sengupta, S. Bowers, Dr. H. Wang, Prof. D. B. Rutledge, Prof. S. Weinreb of Caltech and Dr. A. Natarajan, Dr. I. Aoki, Dr. S. Kee, Dr. A. Komijani, Dr. X. Guan, Dr. Y. Wang, Prof. H. Hashemi, Prof. J. Buckwalter, and Prof. E. Afshari formerly of Caltech for their numerous contribution to Caltech's mm-wave activities. We have benefitted from the support of Caltech's Lee Center for Advance Networking, Raytheon Company, National Science Foundation, and DARPA Trusted Foundry Program. Parts of this work appeared in [25] and [26] previously.

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