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Published December 17, 2008 | Accepted Version
Journal Article Open

High-resolution three-dimensional extracellular recording of neuronal activity with microfabricated electrode arrays

Abstract

Microelectrode array recordings of neuronal activity present significant opportunities for studying the brain with single-cell and spike-time precision. However, challenges in device manufacturing constrain dense multisite recordings to two spatial dimensions, whereas access to the three-dimensional (3D) structure of many brain regions appears to remain a challenge. To overcome this limitation, we present two novel recording modalities of silicon-based devices aimed at establishing 3D functionality. First, we fabricated a dual-side electrode array by patterning recording sites on both the front and back of an implantable microstructure. We found that the majority of single-unit spikes could not be simultaneously detected from both sides, suggesting that in addition to providing higher spatial resolution measurements than that of single-side devices, dual-side arrays also lead to increased recording yield. Second, we obtained recordings along three principal directions with a multilayer array and demonstrated 3D spike source localization within the enclosed measurement space. The large-scale integration of such dual-side and multilayer arrays is expected to provide massively parallel recording capabilities in the brain.

Additional Information

© 2008 by the American Physiological Society. Submitted 3 September 2008; accepted in final form 12 December 2008. This work was supported by a Broad Fellows Program in Brain Circuitry grant to J. Du and S. C. Masmanidis, Della Martin Foundation and Beckman Foundation grants to I. H. Riedel-Kruse, and a National Institute on Deafness and Other Communication Disorders grant to G. Laurent. We thank C. Koch for advice and support; S. Cassenaer, Z. Nádasdy, U. Rutishauser, T. Siapas, M. Vähäsöyrinki, and H. Xu for discussions and technical assistance; and M. Walsh and T. Heitzman for electronic hardware. Device fabrication was carried out at the Kavli Nanoscience Institute, Caltech, and the National Nanotechnology Infrastructure Network, University of California, Santa Barbara.

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