Chemical patterning for the highly specific and programmed assembly of nanostructures
Abstract
We have developed a new chemical patterning technique based on standard lithography-based processes to assemble nanostructures on surfaces with extraordinarily high selectivity. This patterning process is used to create patterns of aminosilane molecular layers surrounded by highly inert poly (ethylene glycol) (PEG) molecules. While the aminosilane regions facilitate nanostructure assembly, the PEG coating prevents adsorption of molecules and nanostructures, thereby priming the semiconductor substrate for the highly localized and programmed assembly of nanostructures. We demonstrate the power and versatility of this manufacturing process by building multilayered structures of gold nanoparticles attached to molecules of DNA onto the aminosilane patterns, with zero nanocrystal adsorption onto the surrounding PEG regions. The highly specific surface chemistry developed here can be used in conjunction with standard microfabrication and emerging nanofabrication technology to seamlessly integrate various nanostructures with semiconductor electronics.
Additional Information
©2005 American Vacuum Society (Received 24 March 2005; accepted 31 May 2005; published 18 July 2005) The authors are grateful to Professor Paul Alivisatos of the University of California at Berkeley, who graciously allowed us to make use of all the facilities of his laboratory in the Department of Chemistry. They also thank Dr. Daniele Gerion of Lawrence Livermore National Laboratory and Yadong Yin of the Department of Chemistry at Berkeley for useful discussions and help with experiments. They acknowledge the Berkeley Microfabrication Laboratory for providing microfabrication facilities and the assistance of Dr. Gordon Vrdoljak of the Robert D. Ogg Electron Microscopy Center with SEM imaging. A.M. thanks the National Science Foundation, Basic Energy Sciences, Department of Energy, and DARPA for their suppoprt. He also thanks the Miller Institute for a Professorship. B.K. was supported by a scholarship from the Department of Mechanical Engineering at UCB, S.S. and K.C. were supported by a grant from DARPA. R.P.K. was supported by an NSDEG fellowship.Files
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- Eprint ID
- 4873
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- CaltechAUTHORS:KANjvstb05
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2006-09-11Created from EPrint's datestamp field
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2021-11-08Created from EPrint's last_modified field