Underwater flexible shear-stress sensor skins
Abstract
This paper reports the development of underwater flexible shear-stress sensor skins that enable not only the acquisition of shear-stress distributions on non-planar surfaces but also a reliable packaging scheme. The sensor skin fabrication consists of two steps: the fabrication of shear-stress sensors on silicon wafers and the fabrication of flexible skins by forming arrays of silicon islands sandwiched by two polyimide layers. The fabricated sensor skin has been packaged on a metal plug and bonding pads were folded to the back side through a slit on the plug. Wire bonding was performed on the back side to improve the reliability and minimize flow interference. The packaged sensor skin has been installed on a water tunnel and successfully tested.
Additional Information
© 2004 IEEE. This project is supported by the Office of Naval Research through an SBIR grant and the NSF Center for Neuromorphic System Engineering at Caltech.Attached Files
Published - 01290714.pdf
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Additional details
- Eprint ID
- 95153
- Resolver ID
- CaltechAUTHORS:20190501-154134255
- Office of Naval Research (ONR)
- NSF
- Center for Neuromorphic Systems Engineering, Caltech
- Created
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2019-05-01Created from EPrint's datestamp field
- Updated
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2021-11-16Created from EPrint's last_modified field