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Published December 2018 | public
Journal Article

Low-Temperature Noise Performance of SuperSpec and Other Developments on the Path to Deployment

Abstract

SuperSpec is a compact on-chip spectrometer operating at mm and sub-mm wavelengths which will enable the construction of sensitive multibeam spectrometers. SuperSpec employs a filter bank architecture, consisting of lithographically patterned niobium superconducting microstrip mm-wave resonators. The power admitted by each resonator is detected by a titanium nitride lumped-element kinetic inductance detector (KID) with resonant frequency from 100 to 200 MHz. We present a characterization of the detector noise performance down to 10 mK measured in a dark setting. We report a device NEP of 2.7×10^(−18)W Hz^(−1/2) at 210 mK, which is below the expected photon noise level at high-altitude ground-based observatories. The NEP decreases to a constant value of approximately 7.0×10^(−19)W Hz^(−1/2) below 130 mK. The white noise is well modeled by thermal generation–recombination noise (GR noise) down to 130 mK and a noise floor at low temperatures. Moreover, the addition of low-pass coaxial filters further reduces the noise floor to achieve an NEP of 5.7×10^(−19)W Hz^(−1/2) below 100 mK. We discuss a photolithographic technique to adjust KID resonances that results in an f0 designed versus measured scatter of 1.7×10^(−5) , which will allow a significant reduction in resonators lost to clashes in full-scale designs. Finally, we present a demonstration of a new ROACH-2-based readout system operating below 500 MHz and show preliminary data indicating the suitability of this system for future highly multiplexed KID arrays.

Additional Information

© Springer Science+Business Media, LLC, part of Springer Nature 2018. Received: 15 November 2017 / Accepted: 27 August 2018. This material is based upon work supported by the National Science Foundation under Grant No. AST-1407457. Partial support was also provided by the NASA Space Technology Research Fellowship NNX15AQ09H.

Additional details

Created:
August 19, 2023
Modified:
March 5, 2024