Published July 1, 2015
| public
Journal Article
Silver as a highly effective bonding layer for lead telluride thermoelectric modules assembled by rapid hot-pressing
Abstract
We use the rapid hot-pressing method to bond Ag foil onto pure PbTe in order to assess its effectiveness as a bonding layer material for thermoelectric module applications. Scanning electron microscopy and X-ray diffraction are employed to examine intermetallic compound formation and microstructure evolution during isothermal aging at 400 °C and 550 °C. We find that Ag is a promising bonding material for PbTe modules operating at T_(Hot) ⩽ 400 °C. Additionally, our approach highlights a highly effective and inexpensive method to metallize PbTe prior to module assembly.
Additional Information
© 2015 Elsevier Ltd. Received 19 August 2014; Accepted 23 March 2015. This work is financially supported by National Science Council of Taiwan through Grant 101-2221-E-002-162-MY3, the Electronics and Optoelectronics Research Laboratories of Industrial Technology Research Institute, and the Caltech DOW-Bridge program.Additional details
- Eprint ID
- 60197
- DOI
- 10.1016/j.enconman.2015.03.089
- Resolver ID
- CaltechAUTHORS:20150911-123045614
- 101-2221-E-002-162-MY3
- National Science Council (Taipei)
- Industrial Technology Research Institute
- Caltech DOW Bridge Program
- Created
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2015-09-11Created from EPrint's datestamp field
- Updated
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2021-11-10Created from EPrint's last_modified field