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Published June 5, 1995 | Published
Journal Article Open

Fracture strength of free‐standing chemically vapor‐deposited diamond films

Abstract

The fracture strength of free‐standing chemically vapor‐deposited diamond films was assessed by four‐point bending. A two‐parameter Weibull analysis was performed on 130 μm thick films resulting in a Weibull modulus of 4.3 and a statistical scaling stress of 626 MPa. The residual stress in films was measured from the free‐standing film curvature to be 384±10 MPa. The fracture surface chemistry was examined using scanning Auger spectroscopy. The fracture did not occur preferentially along grain boundaries.

Additional Information

© 1995 American Institute of Physics. (Received 11 October 1994; accepted for publication 18 March 1995). The authors wish to thank D. Spaulding and Y.-W. Chung for their assistance in scanning Auger spectroscopy analysis. Support of this work was provided by the National Science Foundation under Grant No. DMR-9023629 for T.E.S. and K.T.F. and Grant No. III-9360024 for M.D.D.

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August 20, 2023
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