Dry Mechanical Liftoff Technology for Metallization on Parylene-C Using SU-8
Abstract
This paper presents a new fabrication method to employ dry mechanical liftoff of SU-8 mask to pattern metals on parylene-C film. Soaking tests were done to examine the adhesion between SU-8 and parylene-C film with different interface treatments. SU-8 masks with different thickness were tested in order to find out the best trade-off between the feature sizes and the easiness of removal from paryelene-C film after metal deposition. Features from 10 μm to 300 μm in diameter and width were successfully patterned on parylene-C film by this method. The 15 μm thick SU-8 liftoff mask is highly flexible and can be peeled off mechanically from parylene-C film by tweezers seconds without any visible residue. Metal lines with testing pads from 10 μm to 100 μm wide and 1 cm long were also fabricated and tested to evaluate their resistances. This new method provides an alternative way of metallization on parylene-C film which benefits the application in MEMS area.
Additional Information
© 2012 IEEE. This work is supported by Biomimetic MicroElectronic Systems (BMES). The authors would also like to thank Dr. Wentai Liu from UCSC for providing 268 channel retinal stimulation chips and Mr. Trevor Roper and other members of the Caltech Micromachining Laboratory for assistance with fabrication and fruitful discussion.Additional details
- Eprint ID
- 37837
- Resolver ID
- CaltechAUTHORS:20130409-151812052
- Biomimetic MicroElectronic Systems (BMES)
- Created
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2013-04-09Created from EPrint's datestamp field
- Updated
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2021-11-09Created from EPrint's last_modified field
- Other Numbering System Name
- INSPEC Accession Number
- Other Numbering System Identifier
- 12725777