Published January 2012
| public
Book Section - Chapter
High yield packaging for high-density multi-channel chip integration on flexible parylene substrate
Abstract
This paper reports a new chip packaging technique for the assembly of retinal prosthesis device. Here, a photoresist is used as glue to attach a chip to the targeted parylene-C substrate so that 94% of the chip area is used as attachment to prevent delamination. As a validation, chips with 268 connections were used to assess the connection yield. The results show that this new technique, combined with an additional parylene-C coating, provide a high connection yield (>90%) and is a promising method for high-lead-count implant devices.
Additional Information
© 2012 IEEE. Date of Current Version: 15 March 2012. This work is supported by Biomimetic MicroElectronic Systems (BMES). The authors would also like to thank Dr. Wentai Liu from UCSC for providing 268 channel retinal stimulation chips and Mr. Trevor Roper and other members of the Caltech Micromachining Laboratory for assistance with fabrication and fruitful discussion.Additional details
- Eprint ID
- 36728
- Resolver ID
- CaltechAUTHORS:20130201-084703276
- Biomimetic MicroElectronic Systems (BMES)
- Created
-
2013-02-27Created from EPrint's datestamp field
- Updated
-
2021-11-09Created from EPrint's last_modified field
- Other Numbering System Name
- INSPEC Accession Number
- Other Numbering System Identifier
- 12618007