Published April 18, 2012
| Submitted
Report
Open
The Polygon Package
- Creators
- Sutherland, Ivan E.
Abstract
The memoranda listed below describe the polygon package in its present state. For easy reference, these memoranda have been packaged together. Some of the material included is obsolete. In general, the later-dated material is better than the earlier material. Some specific hazards are indi~ated in the index below.
Additional Information
Series numbering on title page: Technical Report #1438. Silicon Structures Project sponsored by Burroughs Corporation, Digital Equipment Corporation, Hewlett Packard Company, Honeywell Incorporated, International Business Machines Corporation, Intel Corporation, Xerox Corporation, and the National Science Foundation.Attached Files
Submitted - TR_1438.pdf
Files
TR_1438.pdf
Files
(13.5 MB)
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Additional details
- Eprint ID
- 30160
- DOI
- 10.7907/Z9NG4NKX
- Resolver ID
- CaltechAUTHORS:20120418-103150565
- Burroughs Corporation
- Digital Equipment Corporation
- Hewlett Packard Company
- Honeywell Incorporated
- International Business Machines Corporation
- Intel Corporation
- Xerox Corporation
- NSF
- Created
-
2012-04-18Created from EPrint's datestamp field
- Updated
-
2019-10-03Created from EPrint's last_modified field
- Caltech groups
- Computer Science Technical Reports
- Series Name
- Computer Science Technical Reports
- Series Volume or Issue Number
- 1978.1438